EP506
E-mail:marketing@gzgbs.com
Add:No. 15 Nanxiang Third Road, Science City, Luogang District, Guangzhou City
TEL020-66610777
Parameter
EP- 506 A / B
Epoxy adhesive for multi-layer board filling
Product description
Technical parameter
EP-506 is a two-component solvent-free epoxy potting adhesive, which is filled with dry multi-layer board (splint) to solve the problems of burr pits, difficult grinding and low production efficiency after milling of multi-layer board.
Product characteristics
No solvent, no formaldehyde, no ROHS limit heavy metals;
Fluidity, easy hand mixing, scraping and coating;
High bonding strength, water resistance, heat resistance and chemical resistance;
Wide applicability of substrates;
It can cure quickly at low temperature;
EP-506A/B | Component A
| Component B | |
Viscosity pas (25℃) | 11000-2000
| 1000+200
| |
Specific gravity g/cm3
| 1.56 | 1.38 | |
Use ratio
| 2 | 1 | |
Operation time after mixing （25℃ ） | 60-10 min
| ||
Surface drying time | 4~ 5h
| ||
Curing time | 24h
| ||
Room temperature curing (The above test data are 25℃ room temperature data) | |||
Tensile shear strength | ≥5Mpa (wood test date) | ||
package
Packing: A component 20kg/ bottle, B component 10kg/ bottle
storage
Shipping: sealed and stored in a cool dry place, Group b
It should be sealed and stored away from light for 6 months.
non-flammable and explosive, and can be transported as a general chemical.
Application example
After milling, pour the mixed glue into the groove, wait for the glue to cure, and then mill, effectively remove burrs, and then paint, veneer, and other processes